ANSI |
American National Standards Institute |
FEA |
Finite-Element Analysis |
OSP |
Organic Solder Preservative |
AOI |
Automated Optical Inspection |
FEM |
Finite-Element Modeling |
PB |
Printed Board |
ASCII |
American Standard Code For Information Interchange |
FEP |
Fluorinated Ethylene-Propylene (Teflon) |
PBA |
Printed Board Assembly |
ASIC |
Application Specific Integrated Circuit |
FET |
Field-Effect Transistor |
PBX |
Private Branch Exchange |
ATE |
Automatic Test Equipment |
FFT |
Fast Fourier Transform |
PCA |
Printed Circuit Assembly |
AWG |
American Wire Gauge |
FMEA |
Fault Mode And Effect Analysis |
PCA |
Printed Circuit Assembly |
AXI |
Automated X-Ray Inspection |
FPGA |
Field Programmable Gate Array |
PCB |
Printed Circuit Board |
BGA |
Ball Grid Array |
FPT |
Fine-Pitch Technology |
PCBA |
Printed Circuit Board Assembly |
BOM |
Bill Of Material |
FTP |
File Transfer Protocol |
PCMCIA |
Personal Computer Memory Card International Association |
CAD |
Computer-Aided Design |
GBIB |
General Purpose Interface Bus |
PDH |
Plesiochronous Digital Hierarchy |
CADD |
Computer-Aided Design and Drafting |
HASL |
Hot Air Solder Levelling |
PDM |
Product Data Management |
CAE |
Computer-Aided Engeneering |
HDI |
High Density Interconnect |
PIP |
Pin-In-Paste Technology |
CALS |
Computer-aided Acquisition and Logistic Support(DOD) |
HPGL |
Hewlett Packard Graphic Language |
PLCC |
Plastic Leaded Chip Carrier |
CAM |
Computer-Aided Manufacturing |
HTE |
High Temperature Elongation |
PLM |
Product Lifecycle Management |
CASE |
Computer-Aided Software Engineering |
HTML |
HyperText Markup Language |
PPM |
Parts Per Million |
CAT |
Computer-Aided Testing |
HTTP |
HyperText Transfer Protocol |
PSI |
Pounds Per Square Inch |
CBGA |
Ceramic Ball Grid Array |
IC |
Integrated Circuit |
PTFE |
Polytetrafluoroethylene (Teflon) |
CIM |
Computer-Integrated Manufacturing |
ICAM |
Integrated Computer-Aided Manufacturing |
PTH |
Plated Through-Hole |
CM |
Contract Manufacturer |
ICT |
In-Circuit Test |
PWB |
Printed Wiring Board |
CMOS |
Complimentary Metal-Oxide Semiconductor |
IEC |
International Electrotechnical Commission |
PVC |
Polyvinyl Chloride |
CNC |
Computer Numerical Control |
IECQ |
International Electronic Component Qualification system |
QML |
Qualified Manufacturers List |
COB |
Chip-on-Board |
IEDR |
Initial Engineering Design Review |
QPL |
Qualified Products List |
CPLD |
Complex Programmable Logic Device |
IEEE |
Institute Of Electrical And Electronic Engineers |
QTA |
Quick Turn Around |
CPU |
Central Processing Unit |
IEPS |
International Electronic Packaging Society |
R&R |
Repeatability And Reproducibility |
CRC |
Cyclic Redundancy Check |
IGES |
Integrated Graphics Exchange System |
RAM |
Random Access Memory |
CRT |
Cathode-Ray Tube |
ILB |
Inner-Lead Bonding (Tab) |
RETMA |
Radio Electronics & Television Manufacturers Association |
CSP |
Chip Scale Package |
IP |
Internet Protocol |
RF |
Radio Frequency |
CTE |
Coefficient Of Thermal Expansion |
IPC |
Institute for Printed Circuits |
RFI |
Radio-Frequency Interference |
DBMS |
DataBase Management System |
IR |
InfraRed |
RISC |
Reduced Instruction Set Computing |
DFM |
Design For Manufacturability |
ISO |
International Organization For Standardization |
RMS |
Root Mean Square |
DFSM |
Dry Film Solder Mask |
JEDEC |
Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council) |
ROM |
Read Only Memory |
DFT |
Design For Testability |
JIT |
Just-In-Time (Manufacturing) |
SAE |
Society Of Automotive Engineers |
DIN |
Deutsches Institut für Normung |
KGB |
Known Good Board |
SDH |
Synchronous Digital Hierarchy |
DIP |
Dual In-line Package |
KGD |
Known Good Die |
SMD |
Surface Mounted Device |
DMA |
Direct Memory Access |
LAN |
Local Area Network |
SMOBC |
Solder Mask Over Bare Copper |
DOD |
Department Of Defense |
LBA |
Logical Block Address |
SMT |
Surface Mount Technology |
DOS |
Disc Operating System |
LCCC |
Leadless Ceramic Chip Carrier |
SOIC |
Small Outline Integrated Circuit |
DRC |
Design Rule Checking |
LCD |
Liquid Crystal Display |
SPICE |
Simulation Program, Integrated Circuit Emphasis |
DSP |
Digital Signal Processor |
LDA |
Logic Design Automation |
SQC |
Statistical Quality Control |
DXF |
Data eXchange Format |
LED |
Light-Emitting Diode |
SQL |
Structured Query Language |
ECAD |
Electronic Computer-Aided Design |
LIF |
Low Insertion Force |
STEP |
Standard For Exchange Of Product Model Data |
ECL |
Emitter-Coupled Logic |
MCAD |
Mechanical Computer-Aided Design |
TAB |
Tape-Automated Bonding |
ECN |
Engineering Change Notice |
MCAE |
Mechanical Computer-Aided Engineering |
TCP/IP |
Transmission Control Protocol / Internet Protocol |
ECO |
Engineering Change Order |
MCM |
Multichip Module |
TFE |
Tetrafluoroethylene (Teflon) |
ECR |
Engineering Change Request |
MELF |
Metal Electrode Face (Discrete Leadless Component) |
THT |
Through-Hole Technology |
EDA |
Electronic Design Automation |
MLB |
MultiLayer Board |
TIFF |
Tagged Image File Format |
EDI |
Electronic Data Interchange |
MOS |
Metal-Oxide Semiconductor |
TO |
Transistor Outline |
EDIF |
Electronic Design Interchange Format |
MRP |
Material Requirement Planning |
TQM |
Total Quality Management |
EIA |
Electronics Industry Association |
MTBF |
Mean Time Between Failures |
T's & C's |
Terms And Conditions |
EIS |
Engineering Information System |
MTTR |
Mean Time To Repair |
TTL |
Transistor-Transistor Logic |
EMC |
Electro-Magnetic Compatibility |
NASA |
National Aeronautics And Space Administration |
UHF |
Ultra-High Frequency |
EMF |
Electro-Motive Force |
NBS |
National Bureau Of Standards |
UL |
Underwriter’s Laboratories |
EMI |
Electro-Magnetic Interference |
NC |
Numerical Control |
URL |
Uniform Resource Locator |
EMP |
Electro-Magnetic Pulse |
NDT |
Non-Destructive Testing |
VHDL |
Vhsic Hardware Description Language |
EMS |
Electrical Manufacturing Services |
NECQ |
National Electronics Component Qualification System |
VHF |
Very-High Frequency |
ENIG |
Electroless Nickel with Immersion Gold coating |
NEMA |
National Electrtical Manufacturers Association |
VHSIC |
Very-High Speed Integrated Circuits |
ESD |
Electro-Static Discharge |
NPI |
New Product Introduction |
VME |
Versa-Module Electronic |
ESR |
Equivalent Series Resistance |
NPTH |
Non-Plated Through-Hole |
WYSIWYG |
What You See Is What You Get |
FAR |
Failure Analysis Report |
OEM |
Original Equipment Manufacturer |
ZAF |
Z-Axis Adhesive Film |
FCC |
Federal Communications Commission |
OFHC |
Oxygen-Free High-Conductivity Copper |
ZIF |
Zero-Insertion Force |
FC-CBGA |
Flip Chip Ceramic Ball Grid Array |
OLB |
Outer-Lead Bonding (Tab) |
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FCT |
Functional Circuit Test |
OSI |
Open Systems Interconnection |
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